• Thermal characterization of VLSI packaging

      Fahey, W. J.; Shope, David Allen, 1958- (The University of Arizona., 1988)
      With electronic packaging becoming more complex, simple hand methods to model the thermal performance of the package are insufficient. As computer aided modeling methods came into use, a test system was developed to verify the predictions produced by such modeling methods. The test system is evaluated for operation and performance. Further, the premise of this type of test (the accurate calibration of packaged temperature-sensitive-parameter devices can be done) is investigated using a series of comparative tests. From this information, causes of possible/probable errors in calibration are identified and related to the different methodologies and devices used. Finally, conclusions are presented regarding the further improvement of the test system and methodologies used in this type of testing.