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dc.contributor.advisorCarlile, Robert N.en_US
dc.contributor.authorGeha, Sam George.
dc.creatorGeha, Sam George.en_US
dc.date.accessioned2011-10-31T17:43:03Z
dc.date.available2011-10-31T17:43:03Z
dc.date.issued1991en_US
dc.identifier.urihttp://hdl.handle.net/10150/185607
dc.description.abstractClouds of contamination particles suspended in process plasma have been observed by several workers. This dissertation reports on the electrical properties of such clouds (referred to as Electrostatic Particle Traps or EPT) in an argon sputter plasma using a silicon wafer placed upon a graphite substrate. Particle traps were illuminated using a specially adopted laser scanning technique. A tuned Langmuir probe was then inserted into the region of the trap and used to map several parameters including the time-averaged plasma potential. The trap was found to be as much as 5 volts higher in plasma potential than the surrounding plasma. Elementary electrostatics dictates that the trap is a region of net positive charge with an electric field being directed outward from the trap. Thus, negatively charged particles will flow into the trap. It was also found that the electrical properties of contamination particle traps are highly dependent upon the topography of the target and the materials used, with different results being obtained for each material combination. The Langmuir probe was also found to be an effective tool for mapping the interface between the plasma and the sheath to within 0.5 mm; the interface follows the topography on the wafer electrode.
dc.language.isoenen_US
dc.publisherThe University of Arizona.
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.subjectDissertations, Academicen_US
dc.subjectElectrical engineering.en_US
dc.titleThe electrical properties of contamination particle traps in a process plasma.en_US
dc.typetexten_US
dc.typeDissertation-Reproduction (electronic)en_US
dc.identifier.oclc711788092en_US
thesis.degree.grantorUniversity of Arizonaen_US
thesis.degree.leveldoctoralen_US
dc.contributor.committeememberO'Hanlon, John F.en_US
dc.contributor.committeememberParks, Harold G.en_US
dc.identifier.proquest9202078en_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.namePh.D.en_US
dc.description.noteThis item was digitized from a paper original and/or a microfilm copy. If you need higher-resolution images for any content in this item, please contact us at repository@u.library.arizona.edu.
dc.description.admin-noteOriginal file replaced with corrected file August 2023.
refterms.dateFOA2018-06-23T23:54:00Z
html.description.abstractClouds of contamination particles suspended in process plasma have been observed by several workers. This dissertation reports on the electrical properties of such clouds (referred to as Electrostatic Particle Traps or EPT) in an argon sputter plasma using a silicon wafer placed upon a graphite substrate. Particle traps were illuminated using a specially adopted laser scanning technique. A tuned Langmuir probe was then inserted into the region of the trap and used to map several parameters including the time-averaged plasma potential. The trap was found to be as much as 5 volts higher in plasma potential than the surrounding plasma. Elementary electrostatics dictates that the trap is a region of net positive charge with an electric field being directed outward from the trap. Thus, negatively charged particles will flow into the trap. It was also found that the electrical properties of contamination particle traps are highly dependent upon the topography of the target and the materials used, with different results being obtained for each material combination. The Langmuir probe was also found to be an effective tool for mapping the interface between the plasma and the sheath to within 0.5 mm; the interface follows the topography on the wafer electrode.


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