The effects of losses for electrical interconnections in VLSI packaging environments.

Abstract

The effects of losses for electrical interconnections in VLSI packaging environments have been investigated in terms of attenuation, dispersion, propagation delay, reflection, crosstalk, overshoot/undershoot and ground noise resonance. Three types of loss are considered here; they are conductor loss (due to either DC loss or skin effect loss), dielectric loss and insertion loss. The advantages and disadvantages of either conductor loss or dielectric loss in signal propagation are examined. The model for ground noise resonance effect in nonuniformly coupled ribbon cables is first introduced, and then one of the more practical solutions to this problem is demonstrated by applying insertion loss to the cables at the resonant frequency. General design guidelines and parameter trade-off considerations for preserving signal integrity (i.e., less signal distortion and lower coupled noise) during transmission are also included.