Novel and Efficient Numerical Analysis of Packaging Interconnects in Layered Media

Abstract

Technology trends toward lower power, higher speed and higher density devices have pushed the package performance to its limits. The high frequency effects e.g., crosstalk and signal distortion, may cause high bit error rates or malfunctioning of the circuit. Therefore, the successful release of a new product requires constant attention to the high frequency effects through the whole design process. Full-wave electromagnetic tools must be used for this purpose. Unfortunately, currently available full-wave tools require excessive computational resources to simulate large-scale interconnect structures.A prototype version of the Full-Wave Layered-Interconnect Simulator (UA-FWLIS), which employs the Method of Moments (MoM) technique, was developed in response to this design need. Instead of using standard numerical integration techniques, the MoM reaction elements were analytically evaluated, thereby greatly improving the computational efficiency of the simulator. However, the expansion and testing functions that are employed in the prototype simulator involve filamentary functions across the wire. Thus, many problems cannot be handled correctly. Therefore, a fundamental extension is made in this dissertation to incorporate rectangular-based, finite-width expansion and testing functions into the simulator. The critical mathematical issues and theoretical issues that were met during the extension are straightened out. The breakthroughs that were accomplished in this dissertation lay the foundation for future extensions. A new bend-cell expansion function is also introduced, thus allowing the simulator to handle bends on the interconnects with fewer unknowns. In addition, the Incomplete Lipschitz-Hankel integrals, which are used in the analytical solution, are studied. Two new series expansions were also developed to improve the computational efficiency and accuracy.