Modeling and Characterization of Plane Pair Structures in High-Speed Power Delivery Systems

Abstract

The power/ground plane structure within an electronic system not only delivers power, but also provides return path for the currents associated with the propagating signals. The cavity resonances within the power/ground plane structure affect the signal integrity of the system at high frequencies. The chip complexity and clock speed continue to increase and new structures, such as meshed planes and electromagnetic bandgap structures, are used in plane pair structure design. The signal integrity analysis of the power/ground plane structure becomes exceedingly important and challenging.The primary goal of this research is an in-depth investigation of the impact of the cavity resonances associated with the plane pair structure on the signal integrity. This includes development of modeling, simulation, and measurement methodologies for accurate and efficient characterization or prediction of the time/frequency domain electrical characteristics of power/ground plane pair structures. This research is divided into three parts. First, new SPICE compatible models are proposed for the new structures, such as the meshed plane and EBG embedded plane pair designs, so that the power/ground plane designs with these new structures can be simulated efficiently. Second, the accuracy of the simulation results is vital. The behavior of the benchmark structures is simulated and simulation results are verified either experimentally or by comparing with those from tools that are proven to be accurate. Third, high frequency measurement data is vulnerable to all parasitic parameters. The factors that affect the accuracy of measured data are investigated and methods to improve the accuracy of the measured data are proposed and verified.