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dc.contributor.advisorDvorak, Steven L.en_US
dc.contributor.authorPasha, Soheila
dc.creatorPasha, Soheilaen_US
dc.date.accessioned2013-02-05T20:06:03Z
dc.date.available2013-02-05T20:06:03Z
dc.date.issued2012
dc.identifier.urihttp://hdl.handle.net/10150/268354
dc.description.abstractA computationally efficient, discrete model is presented for transmission line analysis and passive model order reduction of high-speed interconnect systems. The development of this model was motivated by the on-going efforts in chip/package co-design to route a major portion of the on-chip clock and high-speed data buses through the package in order to overcome the bandwidth reduction and delay caused by the high ohmic loss of on-chip wiring. The geometric complexity of the resulting interconnections is such that model order reduction is essential for rapid and accurate signal integrity assessment to support pre-layout design iteration and optimization. The modal network theory of the skin effect in conjunction with the theory of compact differences is used for the development of discrete models for dispersive, multi-conductor interconnects compatible with passive model order reduction algorithms. The passive reduced-order interconnect modeling algorithm, PRIMA, is then used on the resulting discrete model to generate a low-order, multi-port macromodel for interconnect networks. Numerical examples are used to demonstrate the validity and efficiency of the proposed model.
dc.language.isoenen_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.subjectHigh Speed Interconnectsen_US
dc.subjectModel Order reductionen_US
dc.subjectPassiveen_US
dc.subjectTransmission Linesen_US
dc.subjectElectrical & Computer Engineeringen_US
dc.subjectDispersive Interconnectsen_US
dc.subjectFrequency dependent ohmic lossen_US
dc.titleElectromagnetic Modeling of High-Speed Interconnects with Frequency Dependent Conductor Losses, Compatible with Passive Model Order Reduction Techniquesen_US
dc.typetexten_US
dc.typeElectronic Dissertationen_US
thesis.degree.grantorUniversity of Arizonaen_US
thesis.degree.leveldoctoralen_US
dc.contributor.committeememberMelde, Kathleen L.en_US
dc.contributor.committeememberRoveda, Janet Meilingen_US
dc.contributor.committeememberDvorak, Steven L.en_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical & Computer Engineeringen_US
thesis.degree.namePh.D.en_US
refterms.dateFOA2018-04-26T05:02:39Z
html.description.abstractA computationally efficient, discrete model is presented for transmission line analysis and passive model order reduction of high-speed interconnect systems. The development of this model was motivated by the on-going efforts in chip/package co-design to route a major portion of the on-chip clock and high-speed data buses through the package in order to overcome the bandwidth reduction and delay caused by the high ohmic loss of on-chip wiring. The geometric complexity of the resulting interconnections is such that model order reduction is essential for rapid and accurate signal integrity assessment to support pre-layout design iteration and optimization. The modal network theory of the skin effect in conjunction with the theory of compact differences is used for the development of discrete models for dispersive, multi-conductor interconnects compatible with passive model order reduction algorithms. The passive reduced-order interconnect modeling algorithm, PRIMA, is then used on the resulting discrete model to generate a low-order, multi-port macromodel for interconnect networks. Numerical examples are used to demonstrate the validity and efficiency of the proposed model.


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