THE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALS
| dc.contributor.author | Rasafar, Hamid, 1954- | |
| dc.creator | Rasafar, Hamid, 1954- | en_US |
| dc.date.accessioned | 2013-03-28T10:07:14Z | |
| dc.date.available | 2013-03-28T10:07:14Z | |
| dc.date.issued | 1987 | en_US |
| dc.identifier.uri | http://hdl.handle.net/10150/276509 | |
| dc.description.abstract | New VLSI and VHSIC devices require increased performance from electronic packages. The major challenge that must be met in materials/process development for high complexity and high speed integrated circuits is the processing of even larger amounts of signals with low propagation delay. Hence, materials with low dielectric constant and low dissipation factor are being sought. In this investigation the dielectric properties of the most commonly used composite materials for printed circuit boards, Teflon-glass and Epoxy-glass, were measured in the frequency and temperature intervals of 100 HZ-1 GHZ and 25-260°C, respectively. From the measured results, it is concluded that Teflon-glass is more suitable for the board level packaging of high performance circuits due to its lower dielectric constant and low dissipation factor. | |
| dc.language.iso | en_US | en_US |
| dc.publisher | The University of Arizona. | en_US |
| dc.rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. | en_US |
| dc.subject | Integrated circuits -- Very large scale integration -- Packaging. | en_US |
| dc.subject | Dielectric heating. | en_US |
| dc.title | THE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALS | en_US |
| dc.type | text | en_US |
| dc.type | Thesis-Reproduction (electronic) | en_US |
| dc.identifier.oclc | 17682265 | en_US |
| thesis.degree.grantor | University of Arizona | en_US |
| thesis.degree.level | masters | en_US |
| dc.identifier.proquest | 1331466 | en_US |
| thesis.degree.discipline | Graduate College | en_US |
| thesis.degree.discipline | Electrical and Computer Engineering | en_US |
| thesis.degree.name | M.S. | en_US |
| dc.identifier.bibrecord | .b16364636 | en_US |
| refterms.dateFOA | 2018-08-16T10:05:00Z | |
| html.description.abstract | New VLSI and VHSIC devices require increased performance from electronic packages. The major challenge that must be met in materials/process development for high complexity and high speed integrated circuits is the processing of even larger amounts of signals with low propagation delay. Hence, materials with low dielectric constant and low dissipation factor are being sought. In this investigation the dielectric properties of the most commonly used composite materials for printed circuit boards, Teflon-glass and Epoxy-glass, were measured in the frequency and temperature intervals of 100 HZ-1 GHZ and 25-260°C, respectively. From the measured results, it is concluded that Teflon-glass is more suitable for the board level packaging of high performance circuits due to its lower dielectric constant and low dissipation factor. |
