Automated radiographic inspection of through-hole electronic circuit board solder defects
AuthorLeal, James Andrew, 1963-
KeywordsPrinted circuits industry -- Quality control.
Electronic circuits -- Testing.
AdvisorDemer, Louis J.
MetadataShow full item record
PublisherThe University of Arizona.
RightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
AbstractA study has been carried out to investigate the use of "real-time" radiography as a method of automated inspection of through-hole electronic circuit board solder joints. By evaluating five major solder defects it has been found that film radiography employing high contrast film results in a definite distinction between a good solder joint and a defective solder joint. The same five defects were also found to be distinguishable from a good solder joint when evaluated by a real-time radiographic inspection unit using digital image processing. Although the type of defect being investigated was not discernible, the ability to distinguish a good solder joint from a defective solder joint is a major step in the implementation of automated solder joint inspection for military electronics.
Degree ProgramGraduate College
Materials Sciences and Engineering