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Thermal characterization of VLSI packaging
| dc.contributor.advisor | Fahey, W. J. | en_US |
| dc.contributor.author | Shope, David Allen, 1958- | |
| dc.creator | Shope, David Allen, 1958- | en_US |
| dc.date.accessioned | 2013-03-28T10:13:38Z | |
| dc.date.available | 2013-03-28T10:13:38Z | |
| dc.date.issued | 1988 | en_US |
| dc.identifier.uri | http://hdl.handle.net/10150/276686 | |
| dc.description.abstract | With electronic packaging becoming more complex, simple hand methods to model the thermal performance of the package are insufficient. As computer aided modeling methods came into use, a test system was developed to verify the predictions produced by such modeling methods. The test system is evaluated for operation and performance. Further, the premise of this type of test (the accurate calibration of packaged temperature-sensitive-parameter devices can be done) is investigated using a series of comparative tests. From this information, causes of possible/probable errors in calibration are identified and related to the different methodologies and devices used. Finally, conclusions are presented regarding the further improvement of the test system and methodologies used in this type of testing. | |
| dc.language.iso | en_US | en_US |
| dc.publisher | The University of Arizona. | en_US |
| dc.rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. | en_US |
| dc.subject | Computers -- Circuits -- Thermal properties. | en_US |
| dc.subject | Integrated circuits -- Very large scale integration -- Thermal properties. | en_US |
| dc.title | Thermal characterization of VLSI packaging | en_US |
| dc.type | text | en_US |
| dc.type | Thesis-Reproduction (electronic) | en_US |
| dc.identifier.oclc | 20697624 | en_US |
| thesis.degree.grantor | University of Arizona | en_US |
| thesis.degree.level | masters | en_US |
| dc.identifier.proquest | 1333263 | en_US |
| thesis.degree.discipline | Graduate College | en_US |
| thesis.degree.discipline | Electrical and Computer Engineering | en_US |
| thesis.degree.name | M.S. | en_US |
| dc.identifier.bibrecord | .b17066384 | en_US |
| refterms.dateFOA | 2018-08-27T09:15:57Z | |
| html.description.abstract | With electronic packaging becoming more complex, simple hand methods to model the thermal performance of the package are insufficient. As computer aided modeling methods came into use, a test system was developed to verify the predictions produced by such modeling methods. The test system is evaluated for operation and performance. Further, the premise of this type of test (the accurate calibration of packaged temperature-sensitive-parameter devices can be done) is investigated using a series of comparative tests. From this information, causes of possible/probable errors in calibration are identified and related to the different methodologies and devices used. Finally, conclusions are presented regarding the further improvement of the test system and methodologies used in this type of testing. |
