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dc.contributor.advisorJohnson, Barry C.en_US
dc.contributor.authorQuilici, James Edwin, 1961-
dc.creatorQuilici, James Edwin, 1961-en_US
dc.date.accessioned2013-03-28T10:14:01Zen
dc.date.available2013-03-28T10:14:01Zen
dc.date.issued1988en_US
dc.identifier.urihttp://hdl.handle.net/10150/276697en
dc.description.abstractMethods of noise coupling in high speed thick film circuits has been investigated. Parasitic coupling parameters have been experimentally determined for a variety of single and multilayer thick film layouts. In addition, the severity of the problem has been studied by measuring coupled noise induced on carefully constructed test cards. Curves are presented as an aid for predicting noise levels as a function of conductor spacing and signal edge speed. The measurements are discussed quantitatively and guidelines for the design of high speed thick film circuits are summarized.
dc.language.isoen_USen_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.subjectThick-film circuits.en_US
dc.subjectCrosstalk.en_US
dc.subjectHybrid integrated circuits.en_US
dc.titleCoupled noise study of thick film circuitsen_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.identifier.oclc20463505en_US
thesis.degree.grantorUniversity of Arizonaen_US
thesis.degree.levelmastersen_US
dc.identifier.proquest1333421en_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.nameM.S.en_US
dc.identifier.bibrecord.b17012831en_US
refterms.dateFOA2018-08-27T09:17:08Z
html.description.abstractMethods of noise coupling in high speed thick film circuits has been investigated. Parasitic coupling parameters have been experimentally determined for a variety of single and multilayer thick film layouts. In addition, the severity of the problem has been studied by measuring coupled noise induced on carefully constructed test cards. Curves are presented as an aid for predicting noise levels as a function of conductor spacing and signal edge speed. The measurements are discussed quantitatively and guidelines for the design of high speed thick film circuits are summarized.


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