Etching in silicon-dioxide with a controllable sidewall angle

Abstract

A selective sloped silicon dioxide etching method has been studied using a temperature controlled diode-type reactive ion etch system with CHCl₃, C₂F₆, H₂ and N₂ gases. The SiO₂ was covered by a polyimide mask with vertical sidewalls and window openings from 1.25-4 microns. Control of the sidewall slope in SiO₂ is possible through varying the ratios of CHCl₃ and C₂F₆. High percentages (95-100%) of CHCl₃ resulted in low etch rates of 420 angstroms/min. Large slopes of up to 65 degrees are possible. With C₂F₆ above 5%, larger etch rates close to 2000 angstroms/min. occur and etching becomes vertical with purely anisotropic profiles at 10% C₂F₆. In a simulation study, SiO₂ sidewall slope was found to be controlled by the isotropic deposition rate as well as the anisotropic etch rate. Optical Multichannel Analysis of the discharge showed an increase in silicon dioxide removal when the percentage of C₂F₆ was increased. (Abstract shortened with permission of author.)