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dc.contributor.advisorRozenblit, Jerzy W.en_US
dc.contributor.authorWhipple, Thomas Driggs, 1961-
dc.creatorWhipple, Thomas Driggs, 1961-en_US
dc.date.accessioned2013-03-28T10:28:57Zen
dc.date.available2013-03-28T10:28:57Zen
dc.date.issued1989en_US
dc.identifier.urihttp://hdl.handle.net/10150/277105en
dc.description.abstractAn interactive software shell has been developed which integrates several packaging simulation tools developed at the University of Arizona which are used to analyze electro-magnetic coupling between interconnects in an integrated circuit. This software shell uses experimental frames to manage this simulation process. Through the experimental frames, the model descriptions and the model inputs are separated, and input data is verified for correctness. This model/input separation allows several model variations to be tested based on several input variations. The results of these simulations are then analyzed and displayed graphically. Further work for the software shell is discussed. This tool provides a user-friendly, efficient method for performing coupled-line analyses in interconnect systems.
dc.language.isoen_USen_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.subjectIntegrated circuits -- Simulation methods.en_US
dc.subjectIntegrated circuits -- Design and construction.en_US
dc.subjectIntegrated circuits -- Very large scale integration.en_US
dc.titleDesign and implementation of an integrated VLSI packaging support software environmenten_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
dc.identifier.oclc23677636en_US
thesis.degree.grantorUniversity of Arizonaen_US
thesis.degree.levelmastersen_US
dc.identifier.proquest1337994en_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.nameM.S.en_US
dc.identifier.bibrecord.b17657179en_US
refterms.dateFOA2018-04-26T09:30:48Z
html.description.abstractAn interactive software shell has been developed which integrates several packaging simulation tools developed at the University of Arizona which are used to analyze electro-magnetic coupling between interconnects in an integrated circuit. This software shell uses experimental frames to manage this simulation process. Through the experimental frames, the model descriptions and the model inputs are separated, and input data is verified for correctness. This model/input separation allows several model variations to be tested based on several input variations. The results of these simulations are then analyzed and displayed graphically. Further work for the software shell is discussed. This tool provides a user-friendly, efficient method for performing coupled-line analyses in interconnect systems.


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