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dc.contributor.advisorPalusinski, O. A.en_US
dc.contributor.authorWerner, Tony Lee, 1965-
dc.creatorWerner, Tony Lee, 1965-en_US
dc.date.accessioned2013-04-03T13:04:12Z
dc.date.available2013-04-03T13:04:12Z
dc.date.issued1991en_US
dc.identifier.urihttp://hdl.handle.net/10150/277863
dc.description.abstractPresently, the power generated by integrated circuit devices can produce significant temperature gradients across the surface of the substrate. The fluctuations to the device operating temperature alter model parameters and can adversely affect circuit operation. However, SPICE can only simulate an electrical circuit characterized by a single uniform temperature for all device elements. The following work describes TWSPICE which is an enhanced version of SPICE developed for electrical and thermal analysis. TWSPICE can accommodate individual operating temperatures for each of the resistor, diode, and bipolar junction transistor elements. Furthermore, a thermal analysis algorithm, known as the Unit Profile Method, has been incorporated within the TWSPICE code to allow iterations between electrical and thermal analyses. Therefore, TWSPICE can be utilized for simulation of electro-thermal interactions in integrated circuits and testing them under more realistic conditions. In addition, examples of application have been included.
dc.language.isoen_USen_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.subjectEngineering, Electronics and Electrical.en_US
dc.subjectEngineering, Mechanical.en_US
dc.subjectComputer Science.en_US
dc.titleA spice enhancement for the simulation and analysis of electro-thermal interactions on integrated circuit devicesen_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
thesis.degree.grantorUniversity of Arizonaen_US
thesis.degree.levelmastersen_US
dc.identifier.proquest1343704en_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.nameM.S.en_US
dc.identifier.bibrecord.b26844084en_US
refterms.dateFOA2018-06-06T03:45:02Z
html.description.abstractPresently, the power generated by integrated circuit devices can produce significant temperature gradients across the surface of the substrate. The fluctuations to the device operating temperature alter model parameters and can adversely affect circuit operation. However, SPICE can only simulate an electrical circuit characterized by a single uniform temperature for all device elements. The following work describes TWSPICE which is an enhanced version of SPICE developed for electrical and thermal analysis. TWSPICE can accommodate individual operating temperatures for each of the resistor, diode, and bipolar junction transistor elements. Furthermore, a thermal analysis algorithm, known as the Unit Profile Method, has been incorporated within the TWSPICE code to allow iterations between electrical and thermal analyses. Therefore, TWSPICE can be utilized for simulation of electro-thermal interactions in integrated circuits and testing them under more realistic conditions. In addition, examples of application have been included.


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