AuthorMaeda, Yoshitsugu, 1957-
KeywordsEngineering, Materials Science.
AdvisorHiskey, J. Brent
MetadataShow full item record
PublisherThe University of Arizona.
RightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
AbstractThe behavior of impurities (in particular arsenic, antimony and bismuth) on copper electrodeposition was investigated using several non-steady state techniques at a temperature of 63°C in cupric sulfate solution (Cu 45 g/l, H₂SO₄ 200 g/l). As a result, group-V elements work as depolarizers against copper deposition and hydrogen evolution. From the result of cyclic voltammetry, copper reduction was subject to an irreversible reaction with a preceding chemical reaction. In general, copper deposition is not significantly effected by group-V impurities at the compositions investigated. Basic electrochemical parameters, except for the transfer coefficient, were also insensitive to these impurity constituents. However, there is a peak due to arsenic reduction (at -0.330 V) in cyclic voltammogram for the As-containing electrolyte. In addition, the effect of impurities on morphologies were investigated by SEM observation and X-ray diffractometry. As a result, group-V promoted truncated deposits and the (110) crystallographic orientation.