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PublisherThe University of Arizona.
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AbstractThe effects of thin silver films (15-210 angstroms) on the oxidation of copper alloy lead frames has been characterized. Silver films were deposited onto copper lead frames by immersion plating in a bath containing potassium silver cyanide, potassium cyanide, and a mercaptan inhibitor. The thickness of films was measured by microfocus x-ray fluorescence and cross-checked by Rutherford backscattering spectrometry. Lead frames coated with silver films were oxidized at 150 to 200°C in a controlled humidity oven. The amount of oxide formed was measured by an electrolytic reduction technique and cross-checked with weight gain measurements. Auger, ESCA, and SEM analysis were also performed on the films. A tape test was performed to obtain qualitative information on the adhesion of the films.