The oxidation of copper and silver plated copper lead frames
| dc.contributor.advisor | Raghavan, Srini | en_US |
| dc.contributor.author | Westlake, Michael Angelo, 1966- | |
| dc.creator | Westlake, Michael Angelo, 1966- | en_US |
| dc.date.accessioned | 2013-04-03T13:19:10Z | |
| dc.date.available | 2013-04-03T13:19:10Z | |
| dc.date.issued | 1993 | en_US |
| dc.identifier.uri | http://hdl.handle.net/10150/278279 | |
| dc.description.abstract | The effects of thin silver films (15-210 angstroms) on the oxidation of copper alloy lead frames has been characterized. Silver films were deposited onto copper lead frames by immersion plating in a bath containing potassium silver cyanide, potassium cyanide, and a mercaptan inhibitor. The thickness of films was measured by microfocus x-ray fluorescence and cross-checked by Rutherford backscattering spectrometry. Lead frames coated with silver films were oxidized at 150 to 200°C in a controlled humidity oven. The amount of oxide formed was measured by an electrolytic reduction technique and cross-checked with weight gain measurements. Auger, ESCA, and SEM analysis were also performed on the films. A tape test was performed to obtain qualitative information on the adhesion of the films. | |
| dc.language.iso | en_US | en_US |
| dc.publisher | The University of Arizona. | en_US |
| dc.rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. | en_US |
| dc.subject | Engineering, Chemical. | en_US |
| dc.subject | Engineering, Metallurgy. | en_US |
| dc.subject | Engineering, Materials Science. | en_US |
| dc.title | The oxidation of copper and silver plated copper lead frames | en_US |
| dc.type | text | en_US |
| dc.type | Thesis-Reproduction (electronic) | en_US |
| thesis.degree.grantor | University of Arizona | en_US |
| thesis.degree.level | masters | en_US |
| dc.identifier.proquest | 1352320 | en_US |
| thesis.degree.discipline | Graduate College | en_US |
| thesis.degree.name | M.S. | en_US |
| dc.identifier.bibrecord | .b27030088 | en_US |
| refterms.dateFOA | 2018-04-26T22:33:33Z | |
| html.description.abstract | The effects of thin silver films (15-210 angstroms) on the oxidation of copper alloy lead frames has been characterized. Silver films were deposited onto copper lead frames by immersion plating in a bath containing potassium silver cyanide, potassium cyanide, and a mercaptan inhibitor. The thickness of films was measured by microfocus x-ray fluorescence and cross-checked by Rutherford backscattering spectrometry. Lead frames coated with silver films were oxidized at 150 to 200°C in a controlled humidity oven. The amount of oxide formed was measured by an electrolytic reduction technique and cross-checked with weight gain measurements. Auger, ESCA, and SEM analysis were also performed on the films. A tape test was performed to obtain qualitative information on the adhesion of the films. |
