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dc.contributor.advisorLynch, David C.en_US
dc.contributor.authorBeatty, Kirk Matthew, 1962-
dc.creatorBeatty, Kirk Matthew, 1962-en_US
dc.date.accessioned2013-04-03T13:19:19Z
dc.date.available2013-04-03T13:19:19Z
dc.date.issued1993en_US
dc.identifier.urihttp://hdl.handle.net/10150/278284
dc.description.abstractCopper aluminosilicate (composition Cu₂O·Al₂O₃·6SiO₂) glass was melted in an alumina crucible at 1500°C and air cooled in situ. A layer of cupric oxide was grown on the polished glass surface and its thickness measured using a scanning electron microscope (SEM). The thickness of the oxide layer was found to increase parabolically with time, with a temperature dependency that was compatible with the diffusion of copper through the layer. The cupric oxide layer was reduced to copper on roughened and polished glass surfaces using a gas mixture of 3% H₂ and 97% N₂, resulting in a glass substrate coated by copper. Adherence of the copper layer to the polished glass substrate was found to be poor. However, adherence was found to increase by roughening the surface before oxidation. Additions of NiO and CaO to the base glass were not detrimental to the production of the copper film.
dc.language.isoen_USen_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.subjectEngineering, Materials Science.en_US
dc.titleProcessing of copper aluminosilicate glasses to produce glass-copper structuresen_US
dc.typetexten_US
dc.typeThesis-Reproduction (electronic)en_US
thesis.degree.grantorUniversity of Arizonaen_US
thesis.degree.levelmastersen_US
dc.identifier.proquest1352330en_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.nameM.S.en_US
dc.identifier.bibrecord.b27086355en_US
refterms.dateFOA2018-08-27T13:43:03Z
html.description.abstractCopper aluminosilicate (composition Cu₂O·Al₂O₃·6SiO₂) glass was melted in an alumina crucible at 1500°C and air cooled in situ. A layer of cupric oxide was grown on the polished glass surface and its thickness measured using a scanning electron microscope (SEM). The thickness of the oxide layer was found to increase parabolically with time, with a temperature dependency that was compatible with the diffusion of copper through the layer. The cupric oxide layer was reduced to copper on roughened and polished glass surfaces using a gas mixture of 3% H₂ and 97% N₂, resulting in a glass substrate coated by copper. Adherence of the copper layer to the polished glass substrate was found to be poor. However, adherence was found to increase by roughening the surface before oxidation. Additions of NiO and CaO to the base glass were not detrimental to the production of the copper film.


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