The electrical properties and reliability of solder bump interconnections
AdvisorPalusinski, Olgierd A.
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PublisherThe University of Arizona.
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AbstractThe electrical properties (resistance, capacitance, and inductance) of spherical solder bumps are computed. The solder bump is modeled using a finite, lossless transmission line model. The resistive, capacitive, and inductive effects are calculated separately then combined using superposition. The transmission line impedance for a 300 μm solder bump is calculated and the effect on a 100 nsec rise time signal is computed. Several methods to calculate fatigue lifetime are examined then related to reliability and design parameters. Methods to improve reliability are examined and their impact on electrical performance discussed.