Characterization and comparison of creep properties for tin-indium-silver solder joints
| dc.contributor.advisor | Jackson, Kenneth A. | en_US |
| dc.contributor.author | Seddon, Michael John, 1971- | |
| dc.creator | Seddon, Michael John, 1971- | en_US |
| dc.date.accessioned | 2013-04-03T13:28:59Z | |
| dc.date.available | 2013-04-03T13:28:59Z | |
| dc.date.issued | 1996 | en_US |
| dc.identifier.uri | http://hdl.handle.net/10150/278555 | |
| dc.description.abstract | In the search of a lead-free solder for use as a replacement of the current tin/lead solders, an alloy consisting of 77.2% tin, 20% indium, and 2.8% silver has been invented. This solder, entitled Indalloy #227, has demonstrated bulk properties comparable to tin/lead solders. Further characterization of this alloy was completed in this research by determining the steady state creep rate properties of actual solder joints. The solder joints were formed using ceramic substrates with gold/nickel/copper and copper pad metallizations. The fabrication process of the samples was optimized to yield the highest shear strength. Creep properties were determined at temperatures ranging from -40°C to 125°C using a set of grips which subjected the samples to pure shear stresses. The activation energy was determined, and a comparison of the creep rates was then made to five other solders. Results from this comparison showed that the 77.2Sn/20.0In/2.8Ag solder demonstrates creep properties similar to those of typical tin/lead solders. | |
| dc.language.iso | en_US | en_US |
| dc.publisher | The University of Arizona. | en_US |
| dc.rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. | en_US |
| dc.subject | Engineering, Electronics and Electrical. | en_US |
| dc.subject | Engineering, Materials Science. | en_US |
| dc.title | Characterization and comparison of creep properties for tin-indium-silver solder joints | en_US |
| dc.type | text | en_US |
| dc.type | Thesis-Reproduction (electronic) | en_US |
| thesis.degree.grantor | University of Arizona | en_US |
| thesis.degree.level | masters | en_US |
| dc.identifier.proquest | 1381945 | en_US |
| thesis.degree.discipline | Graduate College | en_US |
| thesis.degree.discipline | Materials Science and Engineering | en_US |
| thesis.degree.name | M.S. | en_US |
| dc.identifier.bibrecord | .b34294168 | en_US |
| refterms.dateFOA | 2018-06-17T10:52:10Z | |
| html.description.abstract | In the search of a lead-free solder for use as a replacement of the current tin/lead solders, an alloy consisting of 77.2% tin, 20% indium, and 2.8% silver has been invented. This solder, entitled Indalloy #227, has demonstrated bulk properties comparable to tin/lead solders. Further characterization of this alloy was completed in this research by determining the steady state creep rate properties of actual solder joints. The solder joints were formed using ceramic substrates with gold/nickel/copper and copper pad metallizations. The fabrication process of the samples was optimized to yield the highest shear strength. Creep properties were determined at temperatures ranging from -40°C to 125°C using a set of grips which subjected the samples to pure shear stresses. The activation energy was determined, and a comparison of the creep rates was then made to five other solders. Results from this comparison showed that the 77.2Sn/20.0In/2.8Ag solder demonstrates creep properties similar to those of typical tin/lead solders. |
