Additive monitoring and interactions during copper electroprocessing
AuthorCollins, Dale W.
KeywordsEngineering, Materials Science.
AdvisorHiskey, J. Brent
MetadataShow full item record
PublisherThe University of Arizona.
RightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
AbstractThe electrochemical deposition of copper has been a major focus of research for decades. Renewed interest in copper electroplating is not limited to the copper producers but is also a major concern of semiconductor manufacturers. The focus on copper electrochemistry by the semiconductor manufacturers has increased since IBM's announcement in 1997 that copper will be used for metallization in high speed/power semiconductors [1--3]. The desire to use copper instead of aluminum is simply a reflection on copper's superior conductivity (lower RC time constants) and resistance to electromigration (generally proportional to the melting point). This dissertation is the compilation of the research into analytical techniques for monitoring surface-active additives in common sulfuric acid/copper sulfate plating baths. Chronopotentiometric, DC and AC voltammetry were the major analytical techniques used in this research. Several interactions between the additives will also be presented along with their apparent decline in activity. The decline in activity is well known in the industry and is also detected by these methods as presented in chapters 4 and 5. Finally, a systemic approach for monitoring the additive Galactosal, which is commonly used in electrowinning, will be outlined. The monitoring system proposed herein would have to be adjusted for each electrowinning facility because each has a unique chemistry and cell configuration.
Degree ProgramGraduate College
Materials Science and Engineering