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dc.contributor.advisorCangellaris, Andreas C.en_US
dc.contributor.authorPinello, William Patrick
dc.creatorPinello, William Patricken_US
dc.date.accessioned2013-04-18T09:52:23Z
dc.date.available2013-04-18T09:52:23Z
dc.date.issued1997en_US
dc.identifier.urihttp://hdl.handle.net/10150/282565
dc.description.abstractThe Partial Element Equivalent Circuit method is used to develop a flexible, hierarchical electromagnetic modeling and simulation environment for the analysis of noise generation and signal degradation mechanisms in packaged electronic components and systems. The circuit-oriented approach used by the method for the development of the numerical approximation of the electric field integral equation is used to develop a SPICE-compatible, yet fully dynamic, discrete approximation of the electromagnetic problem. Contrary to other full-wave formulations, the proposed method has the important attribute of lending itself to a very systematic and physical model complexity reduction on the basis of the electrical size of the various portions of the system. Thus, a hybrid electromagnetic modeling and simulation environment is established for the analysis of complex structures, which exhibit large variation in electrical size over their volume, using a combination of lumped circuit elements, transmission lines, as well as three-dimensional distributed electromagnetic models which may or may not account for retardation, depending on the electrical size of the part of the structure that is being modeled. These special attributes of the proposed electromagnetic simulation environment are demonstrated through several examples from its application to the modeling of noise interactions in generic interconnect and package geometric.
dc.language.isoen_USen_US
dc.publisherThe University of Arizona.en_US
dc.rightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.en_US
dc.subjectEngineering, Electronics and Electrical.en_US
dc.titleElectromagnetic modeling of noise interactions in packaged electronics using the partial element equivalent circuit formulationen_US
dc.typetexten_US
dc.typeDissertation-Reproduction (electronic)en_US
thesis.degree.grantorUniversity of Arizonaen_US
thesis.degree.leveldoctoralen_US
dc.identifier.proquest9817341en_US
thesis.degree.disciplineGraduate Collegeen_US
thesis.degree.disciplineElectrical and Computer Engineeringen_US
thesis.degree.namePh.D.en_US
dc.identifier.bibrecord.b38268814en_US
refterms.dateFOA2018-06-24T17:02:39Z
html.description.abstractThe Partial Element Equivalent Circuit method is used to develop a flexible, hierarchical electromagnetic modeling and simulation environment for the analysis of noise generation and signal degradation mechanisms in packaged electronic components and systems. The circuit-oriented approach used by the method for the development of the numerical approximation of the electric field integral equation is used to develop a SPICE-compatible, yet fully dynamic, discrete approximation of the electromagnetic problem. Contrary to other full-wave formulations, the proposed method has the important attribute of lending itself to a very systematic and physical model complexity reduction on the basis of the electrical size of the various portions of the system. Thus, a hybrid electromagnetic modeling and simulation environment is established for the analysis of complex structures, which exhibit large variation in electrical size over their volume, using a combination of lumped circuit elements, transmission lines, as well as three-dimensional distributed electromagnetic models which may or may not account for retardation, depending on the electrical size of the part of the structure that is being modeled. These special attributes of the proposed electromagnetic simulation environment are demonstrated through several examples from its application to the modeling of noise interactions in generic interconnect and package geometric.


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