Accurate and efficient integral equation modeling of three-dimensional, passive high-frequency circuit components
AuthorHeckmann, David L., 1965-
AdvisorDvorak, Steven L.
MetadataShow full item record
PublisherThe University of Arizona.
RightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
AbstractRecent advances in multi-layer insulating substrates, such as low temperature co-fired ceramic (LTCC), have motivated novel designs of RF/microwave passive components, such as filters, couplers and power combiners, which attempt to take advantage of the third dimension in order to reduce component size. Such designs are highly desirable for miniature transceiver realizations in portable electronic devices. In addition to advances in new materials and manufacturing processes, an important enabling technology for the realization of such systems is a three-dimensional electromagnetic modeling tool capable of providing the accuracy and computational efficiency necessary for design iteration in a three-dimensional conductor layout. We present a novel approach to the frequency-domain integral-equation modeling of conducting structures embedded in a homogeneous dielectric that is shielded by two perfectly-conducting ground planes. Novel closed-form expressions for the impedance matrix elements arising from a Method of Moments solution of the integral equation are developed. These exact expressions were found to improve the computational efficiency over direct numerical integration by two orders of magnitude, greatly reducing matrix fill times. Several simple structures, including a transmission line and three microwave filters are simulated to test and validate the developed expressions.
Degree ProgramGraduate College
Electrical and Computer Engineering