APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING
AuthorShiang, Jyue-Jon, 1956-
KeywordsSemiconductors -- Packaging -- Testing.
Integrated circuits -- Very large scale integration -- Packaging.
ANSYS (Computer system)
AdvisorPrince, John L.
MetadataShow full item record
PublisherThe University of Arizona.
RightsCopyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
AbstractANSYS Packaging Thermal/Mechanical Calculator (APTMC) is an interface program developed for use with ANSYS and specially designed to handle thermal and thermally induced stress modeling/simulation of Level 1 and Level 2 VLSI packaging structures and assemblies. APTMC is written in PASCAL and operates in an interactive I/O format mode. This user-friendly tool leads an analyst/designer through the process of creating appropriate thermal and thermally induced stress models and other operations necessary to run ANSYS. It includes such steps as the following: (1) construction of ANSYS commands through the string process; (2) creation of a dynamic data structure which expands and contracts during program execution based on the data storage requirements of the program sets to control model generation; (3) access of material data and model parameters from the developed INTERNAL DATABANK which contains: (a) material data list; (b) heat transfer modes; and (c) library of structures; (4) forming ANSYS PREP7 and POSTn command files. (Abstract shortened with permission of author.)
Degree ProgramGraduate College
Electrical and Computer Engineering