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dc.contributor.advisorWicker, Ryanen
dc.contributor.advisorMacDonald, Ericen
dc.contributor.advisorXin, Haoen
dc.contributor.authorYu, Xiaoju
dc.contributor.authorLiang, Min
dc.contributor.authorShemelya, Corey
dc.date.accessioned2016-02-16T22:09:41Zen
dc.date.available2016-02-16T22:09:41Zen
dc.date.issued2015-10en
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/596450en
dc.descriptionITC/USA 2015 Conference Proceedings / The Fifty-First Annual International Telemetering Conference and Technical Exhibition / October 26-29, 2015 / Bally's Hotel & Convention Center, Las Vegas, NVen_US
dc.description.abstractIn this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and high-directive scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.language.isoen_USen
dc.publisherInternational Foundation for Telemeteringen
dc.relation.urlhttp://www.telemetry.org/en
dc.rightsCopyright © held by the author; distribution rights International Foundation for Telemeteringen
dc.subject3D printen
dc.subjectMulti-layeren
dc.subjectPhased Arrayen
dc.subjectVertical Interconnectionen
dc.title3D Printable Multilayer RF Integrated Systemen_US
dc.typetexten
dc.typeProceedingsen
dc.contributor.departmentUniversity of Arizonaen
dc.contributor.departmentUniversity of Texas at El Pasoen
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
refterms.dateFOA2018-07-18T01:06:51Z
html.description.abstractIn this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and high-directive scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).


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