Common Electrical Block CMOS-Based MEMS Sensors for Embedded Instrumentation

Abstract

As the need for embedded instrumentation (EI) grows in the military community, unique telemetry and sensor suites will be required. The typical path for combining sensors and telemetry is to select the packaged sensors for the required measurements and then to configure a separately packaged telemetry device. Today since die level telemetry systems are emerging, it should be considered that sensor suites are integrated at the die level with the telemetry components into a miniature and low power EI system.