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    THE CHALLENGE OF REENGINEERING IN THE FABRICATION OF FLIGHT ELECTRONICS

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    Author
    de Silveira, Carl
    Affiliation
    California Institute of Technology
    Issue Date
    1996-10
    Keywords
    Flight Electronics
    Electronics Fabrication
    Reengineering
    fabrication processes
    Packaging Engineering
    Manufacturing Engineering
    JPL processes
    
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    Rights
    Copyright © International Foundation for Telemetering
    Collection Information
    Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
    Publisher
    International Foundation for Telemetering
    Journal
    International Telemetering Conference Proceedings
    Abstract
    As we adopt and implement the doctrines of reengineering, we at NASA/Jet Propulsion Laboratory (JPL) are asked to make a giant leap in how we think of and design SpaceCraft. We call what we are doing a revolution, since we are not “evolving” to the next step in our activity, but literally leaping beyond it. This is fully in concert with the concepts of reengineering, in that areas that need to be changed are indeed literally invented anew. To be successful, JPL and its industry partners, must perfect processes, techniques and methods that allow them to work together at all levels of the SpaceCraft development cycle. If all other parts of the discipline have moved on and changed, but a key portion remains locked in a time warp of yesterday, we will not be able to reach our desired goal. At the present time change is occurring all over JPL, and it is our intent to describe how it applies to areas where prototype, or one of a kind hardware are fabricated, and how these areas might look when new approaches to doing business are applied. Since all activities in an organization must attain similar levels of expertise or be in danger of hampering the entire process, the issues of Packaging Engineering, Manufactureability, and fabrication become key items.
    Sponsors
    International Foundation for Telemetering
    ISSN
    0884-5123
    0074-9079
    Additional Links
    http://www.telemetry.org/
    Collections
    International Telemetering Conference Proceedings, Volume 32 (1996)

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