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dc.contributor.authorGibson, David
dc.contributor.authorPenrose, N.B.
dc.contributor.authorDoerr, Michael
dc.contributor.authorBorgen, Gary
dc.date.accessioned2016-05-09T20:28:42Zen
dc.date.available2016-05-09T20:28:42Zen
dc.date.issued1999-10en
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/608711en
dc.descriptionInternational Telemetering Conference Proceedings / October 25-28, 1999 / Riviera Hotel and Convention Center, Las Vegas, Nevadaen_US
dc.description.abstractTo meet specific test and evaluation requirements, the Hardened Subminiature Telemetry and Sensor Systems (HSTSS) program is addressing the miniaturization and ‘G’ hardening of telemetry components. Two custom Integrated Circuits (ICs) are in development to support the design of miniature Pulse Code Modulation (PCM) systems with up to 128 analog input channels. This paper describes the design and development of the custom IC chips of the HSTSS Data Acquisition Chipset (DAC). The original requirements, the roll of the Integrated Product Team (IPT), design decisions, a discussion of the additional features, and practical limitations of the Data Acquisition Chipset will be covered.
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.language.isoen_USen
dc.publisherInternational Foundation for Telemeteringen
dc.relation.urlhttp://www.telemetry.org/en
dc.rightsCopyright © International Foundation for Telemeteringen
dc.subjectIRIG-106 PCMen
dc.subjectCustom Integrated Circuiten
dc.subjectSignal Conditioneren
dc.subjectIntegrated Product Team (IPT)en
dc.titleHSTSS-DAC CUSTOM INTEGRATED CIRCUITS FOR SUBMINIATURE PCM TELEMETRY AND SIGNAL CONDITIONINGen_US
dc.typetexten
dc.typeProceedingsen
dc.contributor.departmentSystems & Processes Engineering Corporation (SPEC)en
dc.contributor.departmentNaval Air Warfare Center Weapons Divisionen
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
refterms.dateFOA2018-09-11T10:04:22Z
html.description.abstractTo meet specific test and evaluation requirements, the Hardened Subminiature Telemetry and Sensor Systems (HSTSS) program is addressing the miniaturization and ‘G’ hardening of telemetry components. Two custom Integrated Circuits (ICs) are in development to support the design of miniature Pulse Code Modulation (PCM) systems with up to 128 analog input channels. This paper describes the design and development of the custom IC chips of the HSTSS Data Acquisition Chipset (DAC). The original requirements, the roll of the Integrated Product Team (IPT), design decisions, a discussion of the additional features, and practical limitations of the Data Acquisition Chipset will be covered.


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