CUSTOMIZABLE MULTICHIP MODULES FOR HIGH-G TELEMETRY APPLICATIONS
Affiliation
Army Research LaboratoryMicroelectronics and Computer Technology Corporation
Johns Hopkins University
Issue Date
1999-10Metadata
Show full item recordRights
Copyright © International Foundation for TelemeteringCollection Information
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.Abstract
The Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.Sponsors
International Foundation for TelemeteringISSN
0884-51230074-9079