Author
Muller, PeterBurke, Larry
Sommerfeldt, Scott
Lunceford, Brent
Francomacaro, Shaun
Lehtonen, S. John
Affiliation
Army Research LaboratoryMicroelectronics and Computer Technology Corporation
Johns Hopkins University
Issue Date
1999-10
Metadata
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Copyright © International Foundation for TelemeteringCollection Information
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.Abstract
The Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.Sponsors
International Foundation for TelemeteringISSN
0884-51230074-9079