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CUSTOMIZABLE MULTICHIP MODULES FOR HIGH-G TELEMETRY APPLICATIONS

dc.contributor.authorMuller, Peter
dc.contributor.authorBurke, Larry
dc.contributor.authorSommerfeldt, Scott
dc.contributor.authorLunceford, Brent
dc.contributor.authorFrancomacaro, Shaun
dc.contributor.authorLehtonen, S. John
dc.date.accessioned2016-05-09T20:11:17Zen
dc.date.available2016-05-09T20:11:17Zen
dc.date.issued1999-10en
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/608736en
dc.descriptionInternational Telemetering Conference Proceedings / October 25-28, 1999 / Riviera Hotel and Convention Center, Las Vegas, Nevadaen_US
dc.description.abstractThe Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.language.isoen_USen
dc.publisherInternational Foundation for Telemeteringen
dc.relation.urlhttp://www.telemetry.org/en
dc.rightsCopyright © International Foundation for Telemeteringen
dc.subjectTelemetryen
dc.subjectmultichip modulesen
dc.subjectcopper-polyimideen
dc.subjecthigh-gen
dc.subjectdigital recorderen
dc.subjectin-boreen
dc.titleCUSTOMIZABLE MULTICHIP MODULES FOR HIGH-G TELEMETRY APPLICATIONSen_US
dc.typetexten
dc.typeProceedingsen
dc.contributor.departmentArmy Research Laboratoryen
dc.contributor.departmentMicroelectronics and Computer Technology Corporationen
dc.contributor.departmentJohns Hopkins Universityen
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
refterms.dateFOA2018-04-25T17:21:52Z
html.description.abstractThe Microelectronics and Computer Technology Corporation (MCC) has developed a rapid turn around process for fabricating multichip modules (MCM’s) called the Flexible Manufacturing of MCM’s (FMM). The Army Research Lab (ARL) in co-operation with the Applied Physics Laboratory (APL), has investigated the survivability of this technology in high-g applications. Comparisons were made to other packaging technologies by constructing a 3-channel digital recorder in this and two other competing technologies.


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