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A TELEMETRY TRANSMITTER CHIP SET FOR BALLISTIC APPLICATIONS

dc.contributor.authorLachapelle, John
dc.contributor.authorMcGrath, Finbarr
dc.contributor.authorOsgood, Karina
dc.contributor.authorEgri, Bob
dc.contributor.authorMoysenko, Andy
dc.contributor.authorHenderson, Greg
dc.contributor.authorBurke, Lawrence W., Jr.
dc.contributor.authorFaust, Jonah N.
dc.date.accessioned2016-05-09T20:15:25Zen
dc.date.available2016-05-09T20:15:25Zen
dc.date.issued1999-10en
dc.identifier.issn0884-5123en
dc.identifier.issn0074-9079en
dc.identifier.urihttp://hdl.handle.net/10150/608738en
dc.descriptionInternational Telemetering Conference Proceedings / October 25-28, 1999 / Riviera Hotel and Convention Center, Las Vegas, Nevadaen_US
dc.description.abstractThe U.S. Army’s Hardened Subminiature Telemetry and Sensor Systems (HSTSS) program has engaged the M/A-COM Corporation to work in the development of a highly accurate, crystal controlled telemetry transmitter chip set to be used in Army and other U.S. military munitions. A critical factor in this work is the operating environment of up to 100,000-g launch accelerations. To support the Army in this project, M/A-COM is developing integrated Voltage Controlled Oscillators (VCO) for L and S band, a silicon synthesizer/phase locked loop (PLL) IC, and a family of power amplifiers. Lastly, the transmitter module will be miniaturized and hardened using M/A-COM’s latest chip-onboard mixed technology manufacturing capabilities. This new chip set will provide the telemetry engineer with unprecedented design flexibility. This paper will review the overall transmitter system design and provide an overview for each functional integrated circuit.
dc.description.sponsorshipInternational Foundation for Telemeteringen
dc.language.isoen_USen
dc.publisherInternational Foundation for Telemeteringen
dc.relation.urlhttp://www.telemetry.org/en
dc.rightsCopyright © International Foundation for Telemeteringen
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/
dc.subjectTransmittersen
dc.subjecttelemetryen
dc.subjectmunitionsen
dc.subjecthigh-gen
dc.subjectvoltage controlled oscillatorsen
dc.subjectphase locked loopen
dc.subjectpower amplifiersen
dc.titleA TELEMETRY TRANSMITTER CHIP SET FOR BALLISTIC APPLICATIONSen_US
dc.typetexten
dc.typeProceedingsen
dc.contributor.departmentM/A-COM Corporationen
dc.contributor.departmentU.S. Army Research Laboratory (ARL)en
dc.identifier.journalInternational Telemetering Conference Proceedingsen
dc.description.collectioninformationProceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.en
refterms.dateFOA2018-04-25T19:46:19Z
html.description.abstractThe U.S. Army’s Hardened Subminiature Telemetry and Sensor Systems (HSTSS) program has engaged the M/A-COM Corporation to work in the development of a highly accurate, crystal controlled telemetry transmitter chip set to be used in Army and other U.S. military munitions. A critical factor in this work is the operating environment of up to 100,000-g launch accelerations. To support the Army in this project, M/A-COM is developing integrated Voltage Controlled Oscillators (VCO) for L and S band, a silicon synthesizer/phase locked loop (PLL) IC, and a family of power amplifiers. Lastly, the transmitter module will be miniaturized and hardened using M/A-COM’s latest chip-onboard mixed technology manufacturing capabilities. This new chip set will provide the telemetry engineer with unprecedented design flexibility. This paper will review the overall transmitter system design and provide an overview for each functional integrated circuit.


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