Microprocessor Controlled Thick-Film PCM Telemetry System
| dc.contributor.author | Hakimoglu, Demirhan | |
| dc.date.accessioned | 2016-05-14T00:46:05Z | en |
| dc.date.available | 2016-05-14T00:46:05Z | en |
| dc.date.issued | 1975-10 | en |
| dc.identifier.issn | 0884-5123 | en |
| dc.identifier.issn | 0074-9079 | en |
| dc.identifier.uri | http://hdl.handle.net/10150/609358 | en |
| dc.description | International Telemetering Conference Proceedings / October 14-16, 1975 / Sheraton Inn, Silver Spring, Maryland | en_US |
| dc.description.abstract | This paper describes an approach to airborne PCM data acquisition that takes advantage of the latest technological advances in the fields of both the monolithic microcircuits and hybrid packaging. The result is a low cost system that provides a combination of long sought-after features; flexibility, modular make-up, microminiature size, high reliability and low power. | |
| dc.description.sponsorship | International Foundation for Telemetering | en |
| dc.language.iso | en_US | en |
| dc.publisher | International Foundation for Telemetering | en |
| dc.relation.url | http://www.telemetry.org/ | en |
| dc.rights | Copyright © International Foundation for Telemetering | en |
| dc.title | Microprocessor Controlled Thick-Film PCM Telemetry System | en_US |
| dc.type | text | en |
| dc.type | Proceedings | en |
| dc.contributor.department | Aydin Vector Division | en |
| dc.identifier.journal | International Telemetering Conference Proceedings | en |
| dc.description.collectioninformation | Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection. | en |
| refterms.dateFOA | 2018-09-11T10:25:59Z | |
| html.description.abstract | This paper describes an approach to airborne PCM data acquisition that takes advantage of the latest technological advances in the fields of both the monolithic microcircuits and hybrid packaging. The result is a low cost system that provides a combination of long sought-after features; flexibility, modular make-up, microminiature size, high reliability and low power. |
