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    Electrostatic Coating with Charge-Compensated Ligandless Copper Nanoparticles

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    Author
    Hubbard, Lance Rex
    Issue Date
    2016
    Keywords
    Industrial
    Metal
    Nanoparticle
    Plating
    Thin Film
    Chemical Engineering
    Electroless
    Advisor
    Muscat, Anthony J.
    
    Metadata
    Show full item record
    Publisher
    The University of Arizona.
    Rights
    Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author.
    Embargo
    Release after 31-May-2021
    Abstract
    A nonaqueous electroless deposition (ELD) coating process that uses a charge compensator in lieu of a ligand or complexing agent is presented. Si(100) coupons were hydroxylated using a sulfuric acid-hydrogen peroxide mixture (SPM or piranha). The surface was terminated with an amine group by immersion in a 5 mM solution of (3-aminopropyl)-trimethoxysilane (APTMS) in methanol followed by a 150°C anneal. Metal films were deposited by suspending samples in a bath made by dissolving Cu(II) chloride in ethylene glycol, which also served as the reducing agent, and adding 1-butyl-3-methylimidazolium tetrafluoroborate as a charge compensator. Annealing the coupons at 200°C in nitrogen promoted the formation of an electrically conductive thin film. Four-point probe measurements of the films yielded electrical conductivities in the range 10⁶-10⁷ S/m (10-80% of bulk conductivity). Electron microscopy images of the coated substrates showed a layer structure consisting of nanoparticles. The Cu particle core-ion shell complex is attracted to the positively charged amine groups at high pH depositing a thin metal particle film that is both continuous and conformal. With increasing ionic liquid concentration, film morphology changes from conformal films to discrete islands. In the ionic liquid concentration range from 2.0-2.5 mM, the metal films exhibit increased optical absorbance, luminescence and electrical conductivity. The film properties are correlated to interparticle interactions with electron imagery and spectroscopic ellipsometry. Lastly, a thin metal film was deposited that is both continuous and cohesive on the walls and floor of 5-10X aspect ratio trenches and vias.
    Type
    text
    Electronic Dissertation
    Degree Name
    Ph.D.
    Degree Level
    doctoral
    Degree Program
    Graduate College
    Chemical Engineering
    Degree Grantor
    University of Arizona
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    Dissertations

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