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    NEXT GENERATION FUNCTIONAL COMPONENTS FOR SPACE TELEMETRY DATA PROCESSING

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    Author
    Bennett, Toby
    Looney, Kristin
    Chesney, Jim
    Affiliation
    NASA, Goddard Space Flight Center
    Issue Date
    1991-11
    
    Metadata
    Show full item record
    Rights
    Copyright © International Foundation for Telemetering
    Collection Information
    Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
    Publisher
    International Foundation for Telemetering
    Journal
    International Telemetering Conference Proceedings
    Abstract
    Space telemetry data processing elements for flight and ground systems are currently developed using discrete components on a project-by-project basis. The adoption of various standards, such as those recommended by the Consultative Committee for Space Data Systems (CCSDS), brings commonality of requirements across future NASA communications elements and affords the opportunity to create standard components to meet these requirements. Over the past five years, NASA’s Goddard Space Flight Center (GSFC) has developed a series of high performance Very Large Scale Integration (VLSI) components for space data systems. These standard components have enabled the development of high performance data systems that are an order of magnitude more compact and cost effective than systems of the previous generation. Recent advances in design automation tools and integrated circuit densities have yielded the means to achieve yet another leap in the integration levels, performance and cost reduction of space data systems. Design automation tools can generate complex integrated circuit designs from high level technology independent functional descriptions. A single reusable functional description can be targeted to a variety of circuit technologies including CMOS, ECL and GaAs. With available densities of over 1 million integrated transistors in both CMOS and GaAs technologies, standard components integrating multiple processing elements are realizable for both flight and ground projects. This paper describes the ongoing efforts of the Microelectronics Systems Branch at GSFC to create highly integrated components to meet functions outlined by the CCSDS using design automation techniques.
    Sponsors
    International Foundation for Telemetering
    ISSN
    0884-5123
    0074-9079
    Additional Links
    http://www.telemetry.org/
    Collections
    International Telemetering Conference Proceedings, Volume 27 (1991)

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