Compact Memory Module for High Performance Applications

Abstract

A common problem in many space applications is the need for a reliable large memory capacity in a light weight, low volume package. The Fairchild Space Company (FSC) is developing a high density static RAM based on VHSIC Hybrid Wafer Scale Integration (HWSI) technology for use in high reliability applications. Advances in interconnect technology and electronic packaging result in a bit density of 2.1 x 10⁷ bits per cu. in. Emphasis will be placed on the general benefits to the aerospace community of the device's high packing density and configurable 16, 32, and 64 bit word width. A specific application of the 64 Megabit SRAM module in the Fairchild Solid State Recorder is discussed to illustrate the performance advantage over conventional single chip and less conventional multi-chip package technologies.