• TELEMETRY ENCODER MINIATURIZATION AND RUGGEDIZATION USING MULTI-CHIP MODULE AND SILICON DIE SCAVENGING TECHNOLOGY

      Wolfson, Scott C.; U.S. Army Redstone Test Center (International Foundation for Telemetering, 2017-10)
      The primary objective of this technical paper is to provide details pertaining to telemetry encoder size and weight reductions using Multi-Chip Module (MCM) design techniques and a silicon die scavenging process to decrease MCM development cost. Additional use cases relevant to the Department of Defense (DoD) community and recommendations for future efforts will also be presented.