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    IMPLEMENTATION OF DIGITAL SIGNAL PROCESSING WITH HIGH DATA RATE SENSORS FOR DATA COMPRESSION

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    Author
    Noh, Seongmin
    Yoo, Hoyoung
    Affiliation
    Korea Aerospace Research Institute
    Chungnam National University
    Issue Date
    2017-10
    
    Metadata
    Show full item record
    Rights
    Copyright © held by the author; distribution rights International Foundation for Telemetering
    Collection Information
    Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.
    Publisher
    International Foundation for Telemetering
    Journal
    International Telemetering Conference Proceedings
    Abstract
    The onboard telemetry system of Korea Space Launch Vehicle-II (KSLV-II) acquires acoustic, vibration, and piezoelectric pressure sensors that require high data rate over several kilo samples per second, so the compression method is needed to expand link margin of telemetry system. This paper implements third-octave and FFT signal processing algorithms to reduce sensor data with high compression ratio depends on data acquisition requirements. The developed signal processing hardware module is composed of analog signal conditioning block and digital signal processing block on FPGA, and the digital block is fully implemented with dedicated hardware using HDL. For digital hardware implementation, multistage structure with ANSI standard octave filter bank is used for third-octave processing, and pipelined architecture is used for FFT. The performance of data acquisition and signal processing is evaluated and compared to the commercial data acquisition equipment.
    Sponsors
    International Foundation for Telemetering
    ISSN
    0884-5123
    0074-9079
    Additional Links
    http://www.telemetry.org/
    Collections
    International Telemetering Conference Proceedings, Volume 53 (2017)

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