TELEMETRY ENCODER MINIATURIZATION AND RUGGEDIZATION USING MULTI-CHIP MODULE AND SILICON DIE SCAVENGING TECHNOLOGY
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Copyright © held by the author; distribution rights International Foundation for TelemeteringCollection Information
Proceedings from the International Telemetering Conference are made available by the International Foundation for Telemetering and the University of Arizona Libraries. Visit http://www.telemetry.org/index.php/contact-us if you have questions about items in this collection.Abstract
The primary objective of this technical paper is to provide details pertaining to telemetry encoder size and weight reductions using Multi-Chip Module (MCM) design techniques and a silicon die scavenging process to decrease MCM development cost. Additional use cases relevant to the Department of Defense (DoD) community and recommendations for future efforts will also be presented.Sponsors
International Foundation for TelemeteringISSN
0884-51230074-9079