Communication—Tribology of Retaining Rings in Chemical Mechanical Planarization
AffiliationUniv Arizona, Dept Chem & Environm Engn
MetadataShow full item record
PublisherELECTROCHEMICAL SOC INC
CitationECS J. Solid State Sci. Technol. 2018 volume 7, issue 5, P266-P268
Rights© 2018 The Electrochemical Society
Collection InformationThis item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at firstname.lastname@example.org.
AbstractStribeck and Stribeck+ curves helped determine the tribological mechanisms in the ring-slurry-pad interface. Both methods gave consistent results with the lubrication mechanism starting at "boundary lubrication" and transitioning to "mixed lubrication" as pseudo-Sommerfeld numbers increased. COF for PPS rings were higher than PEEK. They were also higher for inter-level dielectric (ILD) processes as compared to copper. Stribeck curves were used to infer wear rate information about the ring, which in conjunction with Stribeck+ curves could help choose process parameters that balanced wafer removal with ring wear. Data cluster shapes were shown to be due to shear and normal force fluctuations. (C) 2018 The Electrochemical Society.
VersionFinal accepted manuscript