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dc.contributor.authorDiaz, Gabriela
dc.contributor.authorPeckler, Lauren
dc.contributor.authorSampurno, Yasa
dc.contributor.authorPhilipossian, Ara
dc.date.accessioned2018-09-10T22:25:19Z
dc.date.available2018-09-10T22:25:19Z
dc.date.issued2018
dc.identifier.citationECS J. Solid State Sci. Technol. 2018 volume 7, issue 5, P266-P268en_US
dc.identifier.issn2162-8769
dc.identifier.issn2162-8777
dc.identifier.doi10.1149/2.0211805jss
dc.identifier.urihttp://hdl.handle.net/10150/628669
dc.description.abstractStribeck and Stribeck+ curves helped determine the tribological mechanisms in the ring-slurry-pad interface. Both methods gave consistent results with the lubrication mechanism starting at "boundary lubrication" and transitioning to "mixed lubrication" as pseudo-Sommerfeld numbers increased. COF for PPS rings were higher than PEEK. They were also higher for inter-level dielectric (ILD) processes as compared to copper. Stribeck curves were used to infer wear rate information about the ring, which in conjunction with Stribeck+ curves could help choose process parameters that balanced wafer removal with ring wear. Data cluster shapes were shown to be due to shear and normal force fluctuations. (C) 2018 The Electrochemical Society.en_US
dc.language.isoenen_US
dc.publisherELECTROCHEMICAL SOC INCen_US
dc.relation.urlhttp://jss.ecsdl.org/lookup/doi/10.1149/2.0211805jssen_US
dc.rights© 2018 The Electrochemical Societyen_US
dc.titleCommunication—Tribology of Retaining Rings in Chemical Mechanical Planarizationen_US
dc.typeArticleen_US
dc.contributor.departmentUniv Arizona, Dept Chem & Environm Engnen_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.description.collectioninformationThis item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at repository@u.library.arizona.edu.en_US
dc.eprint.versionFinal accepted manuscripten_US
dc.source.journaltitleECS Journal of Solid State Science and Technology
dc.source.volume7
dc.source.issue5
dc.source.beginpageP266
dc.source.endpageP268
refterms.dateFOA2018-09-10T22:25:20Z


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