Laser modulation simulation of micro-crack morphology evolution during chemical etching
AffiliationUniv Arizona, Coll Opt Sci
MetadataShow full item record
PublisherSPIE-INT SOC OPTICAL ENGINEERING
CitationZhi Chen, Huapan Xiao, Zhibin Li, Na Yu, Hairong Wang, and Rongguang Liang "Laser modulation simulation of micro-crack morphology evolution during chemical etching", Proc. SPIE 11063, Pacific Rim Laser Damage 2019: Optical Materials for High-Power Lasers, 110631H (8 July 2019); https://doi.org/10.1117/12.2540729
RightsCopyright © 2019 SPIE.
Collection InformationThis item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at firstname.lastname@example.org.
AbstractSubsurface micro-cracks will be generated during the grinding and polishing processes of optical components. Micro-cracks have a modulation effect on the laser, thereby reducing the laser damage threshold. The FDTD method is used to simulate the light intensity distribution modulated by micro-crack. By comparing the simulation results of radial crack, parabolic crack and elliptic crack, the modulation mechanism of micro-crack is revealed. The results show that for the crack with the same width and depth, light intensity enhancement factor (LIEF) modulated by radial crack on the rear surface and parabolic crack on the front surface is the largest; LIEF modulated by elliptical crack on the rear surface and radial crack on the front surface is the smallest. In addition, when the crack width-depth ratio is the same, the larger the depth, the higher the LIEF. As the width-depth ratio increases, the LIEF value increases firstly, then decreases, and finally approaches a stable value.
VersionFinal published version