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    Micro-fabrication of Si-based optomechanical inertial sensors for cryogenic temperatures

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    Author
    Nelson, A.
    Guzman, F.
    Affiliation
    Wyant College of Optical Sciences, University of Arizona
    Issue Date
    2021
    Keywords
    accelerometer
    Bosch
    Inertial sensor
    micro-fabrication
    
    Metadata
    Show full item record
    Publisher
    SPIE
    Citation
    Nelson, A., & Guzman, F. (2021). Micro-fabrication of Si-based optomechanical inertial sensors for cryogenic temperatures. Proceedings of SPIE - The International Society for Optical Engineering, 11817.
    Journal
    Proceedings of SPIE - The International Society for Optical Engineering
    Rights
    Copyright © 2021 SPIE.
    Collection Information
    This item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at repository@u.library.arizona.edu.
    Abstract
    The design of next generation gravitational wave observatories considers operation at cryogenic temperatures to enhance their sensitivity by reducing thermal noise fluctuations. Inertial sensors are used on the observatory platforms to measure local seismic noise and counteract its effects by active control or subtraction in post-processing. Measuring the displacement of a test mass in a resonator system allows for creation of a compact accelerometer system. Currently, there are no commercial inertial sensors available that are capable of operating at cryogenic temperatures and providing the required sensitivities for gravitational wave observatories. Materials such as fused silica exhibit very low losses at room temperature. However, this changes significantly at lower temperatures. Unlike fused silica, the Q factor of crystalline silicon structures is expected to remain high at low temperatures, making it a likely candidate for use in these types of inertial sensors. We are working to fabricate compact mechanical resonators from Si wafers to test their mechanical response. Micro-fabrication consists of optimizing the photolithography and Bosch etching processes for through-wafer Si etching on a 280 μm, 500 μm, and 1 mm wafer. Successful etching on 280 μm wafers has been achieved. We report on the design, model, and fabrication progress of these resonators. © 2021 SPIE.
    Note
    Immediate access
    ISSN
    0277-786X
    ISBN
    9781510644724
    DOI
    10.1117/12.2594388
    Version
    Final published version
    ae974a485f413a2113503eed53cd6c53
    10.1117/12.2594388
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    UA Faculty Publications

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