An insight into thermal properties of BC3-graphene hetero-nanosheets: a molecular dynamics study
Name:
s41598-021-02576-6.pdf
Size:
1.963Mb
Format:
PDF
Description:
Final Published Version
Author
Dehaghani, M.Z.Molaei, F.
Yousefi, F.
Sajadi, S.M.
Esmaeili, A.
Mohaddespour, A.
Farzadian, O.
Habibzadeh, S.
Mashhadzadeh, A.H.
Spitas, C.
Saeb, M.R.
Affiliation
Mining and Geological Engineering Department, The University of ArizonaIssue Date
2021
Metadata
Show full item recordPublisher
Nature ResearchCitation
Dehaghani, M. Z., Molaei, F., Yousefi, F., Sajadi, S. M., Esmaeili, A., Mohaddespour, A., Farzadian, O., Habibzadeh, S., Mashhadzadeh, A. H., Spitas, C., & Saeb, M. R. (2021). An insight into thermal properties of BC3-graphene hetero-nanosheets: A molecular dynamics study. Scientific Reports.Journal
Scientific ReportsRights
Copyright © The Author(s) 2021. This article is licensed under a Creative Commons Attribution 4.0 International License.Collection Information
This item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at repository@u.library.arizona.edu.Abstract
Simulation of thermal properties of graphene hetero-nanosheets is a key step in understanding their performance in nano-electronics where thermal loads and shocks are highly likely. Herein we combine graphene and boron-carbide nanosheets (BC3N) heterogeneous structures to obtain BC3N-graphene hetero-nanosheet (BC3GrHs) as a model semiconductor with tunable properties. Poor thermal properties of such heterostructures would curb their long-term practice. BC3GrHs may be imperfect with grain boundaries comprising non-hexagonal rings, heptagons, and pentagons as topological defects. Therefore, a realistic picture of the thermal properties of BC3GrHs necessitates consideration of grain boundaries of heptagon-pentagon defect pairs. Herein thermal properties of BC3GrHs with various defects were evaluated applying molecular dynamic (MD) simulation. First, temperature profiles along BC3GrHs interface with symmetric and asymmetric pentagon-heptagon pairs at 300 K, ΔT = 40 K, and zero strain were compared. Next, the effect of temperature, strain, and temperature gradient (ΔT) on Kaptiza resistance (interfacial thermal resistance at the grain boundary) was visualized. It was found that Kapitza resistance increases upon an increase of defect density in the grain boundary. Besides, among symmetric grain boundaries, 5–7–6–6 and 5–7–5–7 defect pairs showed the lowest (2 × 10–10 m2 K W−1) and highest (4.9 × 10–10 m2 K W−1) values of Kapitza resistance, respectively. Regarding parameters affecting Kapitza resistance, increased temperature and strain caused the rise and drop in Kaptiza thermal resistance, respectively. However, lengthier nanosheets had lower Kapitza thermal resistance. Moreover, changes in temperature gradient had a negligible effect on the Kapitza resistance. © 2021, The Author(s).Note
Open access journalISSN
2045-2322Version
Final published versionae974a485f413a2113503eed53cd6c53
10.1038/s41598-021-02576-6
Scopus Count
Collections
Except where otherwise noted, this item's license is described as Copyright © The Author(s) 2021. This article is licensed under a Creative Commons Attribution 4.0 International License.

