Design of an IoT System for the Palletized Distribution Supply Chain with Model-Based Systems Engineering Tools
Affiliation
Department of Systems and Industrial Engineering, The University of ArizonaIssue Date
2022Keywords
Distribution packagingInternet-of-Things
Logistics
Model-Based Requirements
Model-Based Systems Engineering (MBSE)
Pallets
Supply chain
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MDPICitation
Navarro, N., Horvath, L., & Salado, A. (2022). Design of an IoT System for the Palletized Distribution Supply Chain with Model-Based Systems Engineering Tools. Systems.Journal
SystemsRights
Copyright © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).Collection Information
This item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at repository@u.library.arizona.edu.Abstract
In recent years, Internet-of-Things technology (IoT) has been the subject of research in diverse fields of applications. IoT plays an essential role in transitioning enterprises towards a more interconnected paradigm of manufacturing, logistics, services, and business, known as Industry 4.0. This paper presents an operational concept for a system that implements IoT technology in pallets, which are used to move products along supply chains. These sensors will help us gain insight into the conditions experienced by products and unit loads. Having this capability will allow us to obtain the information necessary for better control of product distribution along the supply chain, and to design packaging that is more efficient and effective in protecting products during distribution. In this paper, we show how Model-Based Systems Engineering (MBSE) can be leveraged to create models that capture the required system behaviors, and we address the complexity of an IoT system within the domain of packaging and logistics applications. © 2021 by the authors. Licensee MDPI, Basel, Switzerland.Note
Open access journalISSN
2079-8954Version
Final published versionae974a485f413a2113503eed53cd6c53
10.3390/systems10010004
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Except where otherwise noted, this item's license is described as Copyright © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).