Aluminum scandium nitride films for piezoelectric transduction into silicon at gigahertz frequencies
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Author
Hackett, L.Miller, M.
Beaucejour, R.
Nordquist, C.M.
Taylor, J.C.
Santillan, S.
Olsson, R.H.
Eichenfield, M.
Affiliation
College of Optical Sciences, University of ArizonaIssue Date
2023-08-16
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American Institute of Physics Inc.Citation
L. Hackett, M. Miller, R. Beaucejour, C. M. Nordquist, J. C. Taylor, S. Santillan, R. H. Olsson, M. Eichenfield; Aluminum scandium nitride films for piezoelectric transduction into silicon at gigahertz frequencies. Appl. Phys. Lett. 14 August 2023; 123 (7): 073502. https://doi.org/Journal
Applied Physics LettersRights
© 2023 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution license.Collection Information
This item from the UA Faculty Publications collection is made available by the University of Arizona with support from the University of Arizona Libraries. If you have questions, please contact us at repository@u.library.arizona.edu.Abstract
Recent advances in the growth of aluminum scandium nitride films on silicon suggest that this material platform could be applied for quantum electromechanical applications. Here, we model, fabricate, and characterize microwave frequency silicon phononic delay lines with transducers formed in an adjacent aluminum scandium nitride layer to evaluate aluminum scandium nitride films, at 32% scandium, on silicon interdigital transducers for piezoelectric transduction into suspended silicon membranes. We achieve an electromechanical coupling coefficient of 2.7% for the extensional symmetric-like Lamb mode supported in the suspended material stack and show how this coupling coefficient could be increased to at least 8.5%, which would further boost transduction efficiency and reduce the device footprint. The one-sided transduction efficiency, which quantifies the efficiency at which the source of microwave photons is converted to microwave phonons in the silicon membrane, is 10% at 5 GHz at room temperature and, as we discuss, there is a path to increase this toward near-unity efficiency based on a combination of modified device design and operation at cryogenic temperatures. © 2023 Author(s).Note
Open access articleISSN
0003-6951Version
Final Published Versionae974a485f413a2113503eed53cd6c53
10.1063/5.0151434
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Except where otherwise noted, this item's license is described as © 2023 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution license.